Heat Sink COOL30
With peltier elements, temperature sensor, heat spread plate and with 30W laser diode
- Up to 80W heat load
- High temperature accuracy
- Peltier driven, air cooling
- Available with or without peltier elements, temperature sensor and heat spread plate
- LD- and Cooler-cable included
- Temperature stabilization of passively cooled high power laser diodes and laser arrays up to about 30W optical power
Heat Sink with Peltier elements and gold plated copper heat spread plate.
Suitable for diode lasers with relatively small heating areas.
Heat Sink with Peltier elements and aluminium heat spread plate.
Suitable for diode lasers with medium-sized heating areas.
Heat sink with Peltier elements and without heat spread plate.
Suitable for diode lasers with relatively large heating areas.
Heat sink without Peltier elements and without heat spread plate.
Suitable for diode lasers with integrated Peltier elements.
The heat sink COOL30 was designed for temperature stabilization of high power laser diodes and laser arrays of about 30W optical power. Depending from the temperature difference between laser diode and ambient air the max. heat load is up to 80W. A heat sink includes the metal block, fans for the heat dissipation, the peltier elements (TEC´s), a heat spread plate with a temperature sensor, the laser diode cable and the cooler cable. For using laser diodes with integrated peltier elements and temperature sensor the heat sink is available without peltier elements, temperature sensor and heat spread plate for a reduced price.
|Heat Load (max) with a temperature difference between laser diode module and ambient air of|
|0 K||80 W|
|5 K||60 W|
|10 K||40 W|
|Tmax (hot side)||50°C|
|Temperature Difference||40 K|
|Thermal Resistance||0.15 K/W|
|Temperature Sensor||NTC 10 kOhm|
|Peltier Current||0…±10 A|
|Peltier Voltage||0…±15 V|
|Fan Current||500 mA|
|Fan Voltage||12 V|
|Relative Humidity||30…70 %|
|Dimension (w x d x h) in mm3||230 x 148 x 95|
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